PE International 2024 Agenda

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Monday 15th April 2024 starting at 18:30 CET
18:30 Pre-conference networking drinks reception
Tuesday 16th April 2024 starting at 08:00 CET
08:00 Registration and welcome refreshments
08:50 Housekeeping by Rob Harper - Conference Chair
Technology Developments in WBG: SiC, GaN and Beyond Sponsored by SCREEN Semiconductor Solutions Co., Ltd.
09:00 A View to Demand Growth for SiC Devices and Materials to $10B and Beyond
Presented by Christian Vieider - Coherent
09:20 Aluminum Scandium Nitride (AlScN) a novel material for power electronic applications
Presented by Ali Yassine - University Freiburg
09:40 Facing SiC Challenges Thanks to UV Laser Annealing Products from SCREEN
Presented by Louis Thuries - SCREEN SPE
10:00 Cost-effective SiC substrate manufacturing for power devices enabled by oxide-free wafer bonding
Presented by Dr. Bernd Dielacher - EV Group
10:20 Morning Break
11:00 The Anatomy of Advanced Power Conversion: Normally-Off d-Mode GaN
Presented by Philip Zuk - Transphorm
11:20 Exploring WBG's technical advances with a glimpse into next UWBG
Presented by Taha Ayari - Yole Group
11:40 Electronic Packaging Materials for SiC Power Modules
Presented by Dr. Michael Joerger - Heraeus Electronics
12:00 Gallium Oxide – Taking over from SiC?
Presented by Martin Kuball - University of Bristol
12:20 Lunch Break
13:35 Ezgi Dogmus - Conference Chair
13:35 PowerElec – new metrological tools for quality control of wide bandgap semiconductors
Presented by Sebastian Wood - NPL
13:55 Novel interconnect and packaging technologies for power module manufacturing
Presented by Huub Claassen - Boschman Advanced Packaging Technology
14:15 SiC technology optimisation using advanced modelling tools
Presented by Ahmed Nejim - Silvaco
14:35 Advanced Lapping and polishing processes for SiC Wafers for sustainable and cost effective wafers
Presented by Dr. Ravi Bollina - Pureon AG
14:55 Afternoon Break
Silicon MOSFETs and IGBTs: Evolving for the Future
15:35 Silicon MOSFETs and IGBTs: evolving for the future
Presented by Antonino Gaito - STMicroelectronics
15:55 Future developments within IGBTs, and how they may coexist with SiC
Presented by Callum Middleton - Omdia
16:15 Closing Remarks
16:20 Networking Drinks / Dinner Reception
Wednesday 17th April 2024 starting at 08:00 CET
08:00 Registration and welcome refreshments
08:50 Housekeeping by Denis Marcon - Conference Chair
System Reliability - Testing Times
09:00 SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Thickness Measurement and Wafer Inspection in Power Devices, Automotive, and IoT Applications
Presented by Alessandro Rossi - SCREEN SPE
09:20 Enabling Test Automation in Power Electronics Reliability
Presented by Andrea Vinci - Tektronix
09:40 How to Correctly Select a High Definition Oscilloscope and Probe for SiC and GaN Power Device Measurement Accuracy
Presented by Maurizio Mastrofini - Teledyne LeCroy
Capacity Across the Supply Chain
10:00 Too much too soon? How the SiC supply chain may be heading for overcapacity
Presented by Bex Stone - Exawatt
10:20 The Power Play : Unveiling Capacity Challenges in SiC and GaN Industries
Presented by Ezgi Dogmus - Yole Group
10:40 Morning Break
GaN - Widening the Application Space
11:20 How to unleash the power savings of GaN in high power, high voltage applications
Presented by Rob Gwynne - Quantum Power Transformation
11:40 Bi-directional circuits open up new opportunities in off-grid applications
Presented by Alfred Hesener - Navitas
12:00 Presentation by Wise Integration
Presented by Thierry Bouchet - Wise Integration
12:20 Price competitive GaN power devices to enhance performances, shrinking size and lowering cost of power conversion solutions
Presented by Denis Marcon - Innoscience Europe BV
12:40 GaN is widening the applications field in power electronics
Presented by Eric Moreau - STMicroelectronics
13:00 New Opportunities for Gallium Nitride in Power, Sensing and RF
Presented by Rob Harper - Compound Semiconductor Centre
13:20 Lunch Break
Upgrading the GRID – The Role of Power Electronics (inc. Energy Waste and Efficiency)
14:35 Peter Friedrichs - Conference Chair
14:35 High-Voltage Silicon Carbide Enables an Omnidirectional Grid
Presented by Kevin Speer - Microchip
14:55 The grid of the future and how SiC power devices will enable the transition towards zero CO2
Presented by Peter Friedrichs - Infineon
15:15 3.3 kV SiC MOSFETs Accelerate Grid-Connected Energy Storage
Presented by Ranbir Singh - Navitas
15:35 Closing Remarks
Presentation times and order are subject to change. This agenda was last updated on 02 Mar 2024 at 4:37am.