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The Power Play : Unveiling Capacity Challenges in SiC and GaN Industries | ![]() |
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Future developments within IGBTs, and how they may coexist with SiC | ![]() |
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High voltage power switch: continuous silicon development as contributor to the green transition | ![]() |
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Advanced Lapping and polishing processes for SiC Wafers for sustainable and cost effective wafers | ![]() |
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Cost-effective SiC substrate manufacturing for power devices enabled by oxide-free wafer bonding | ![]() |
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Electronic Packaging Materials for SiC Power Modules | ![]() |
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Exploring WBG's technical advances with a glimpse into next UWBG | ![]() |
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Facing SiC Challenges Thanks to UV Laser Annealing Products from SCREEN | ![]() |
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Gallium Oxide – Taking over from SiC? | ![]() |
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Novel interconnect and packaging technologies for power module manufacturing | ![]() |
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PowerElec – new metrological tools for quality control of wide bandgap semiconductors | ![]() |
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SiC technology optimisation using advanced modelling tools | ![]() |
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SuperGaN’s Performance Advantages Challenging SiC’s Long-Term Use | ![]() |
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Presentation Title | Speaker | Download |
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Activating GaN’s Full Potential with Digital Control for Enhanced Performance Across All Electronics Sectors | ![]() |
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Bi-directional circuits open up new opportunities in off-grid applications | ![]() |
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GaN is widening the applications field in power electronics | ![]() |
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How to unleash the power savings of GaN in high power, high voltage applications | ![]() |
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New Opportunities for Gallium Nitride in Power, Sensing and RF | ![]() |
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Price competitive GaN power devices to enhance performances, shrinking size and lowering cost of power conversion solutions | ![]() |
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Presentation Title | Speaker | Download |
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The grid of the future and how SiC power devices will enable the transition towards zero CO2 | ![]() |
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Enabling Test Automation in Power Electronics Reliability | ![]() |
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How to Correctly Select a High Definition Oscilloscope and Probe for SiC and GaN Power Device Measurement Accuracy | ![]() |
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SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Thickness Measurement and Wafer Inspection in Power Devices, Automotive, and IoT Applications | ![]() |
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