PE International 2026 returned to Brussels for two days of focused, in-depth coverage of the power electronics industry, drawing the community together across materials, devices, and applications. Part of an AngelTech week that welcomed over 800 attendees and a sold-out exhibition floor, the conference featured a packed programme of presentations and panel discussions reflecting the speed of change across GaN, SiC, and the wider wide bandgap landscape - alongside the continued evolution of silicon MOSFETs and IGBTs that still underpin the market.
What set this year apart was the depth of the conversation around real-world demand. Speakers and delegates explored how power electronics innovation is translating into impact across AI infrastructure, data centre densification, automotive electrification, and renewable energy - not as isolated breakthroughs but as part of a wider, interconnected value chain. The addition of Advanced Packaging International alongside CS, PIC, and PE this year reinforced that point, with delegates moving freely between sessions and exhibition stands to see how materials, devices, packaging, and systems now operate as one ecosystem.
But the real value of PE International continues to be measured in conversations rather than counts. Three days under one roof with the engineers, founders, foundries, and end-users shaping the industry - that's where partnerships form, business gets done, and the next wave of innovation takes root. PE International 2026 delivered on that promise at greater scale and with greater connection than ever before.