PRESENTATION

Accelerating the Future: Enabling the Next Era of Advanced Integration with Multibeam- High-Productivity E-Beam Lithography

The semiconductor industry is entering an era defined by unprecedented performance demands, driven by AI, quantum computing, hyperscale data centers, and EV growth. Addressing these inflection points requires lithography solutions that can go beyond the limits of conventional optical and single-beam e-beam technologies. In this presentation, we introduce the world’s first high-productivity multi-column e-beam lithography systems designed for fab production. With large depth of focus, wide field of view, ultra-high resolution, and adaptable patterning capabilities, Multibeam systems enable device makers to achieve novel, performance-optimized system architectures across various growing applications, including advanced packaging, quantum, compound semiconductors/power devices, silicon photonics, rapid prototyping and more. In advanced packaging—where performance, power efficiency, and yield are paramount—our systems are enabling the transition to advanced heterogeneous integration at wafer scale, and rapid production of purpose-built chips. This new generation of packaging allows chip-to-chip interconnects to approach on-chip interconnect performance, enabling an ~10× reduction in latency, ~40× improvement in bandwidth density, and ~100× improvement in transfer-energy-per-bit. Multibeam can also be leveraged to accelerate critical technologies like backside power delivery and provide higher-yielding alternatives to bridge-die approaches, paving the way for scalable, manufacturable heterogeneous integration. Discover how Multibeam’s multi-column e-beam lithography is reshaping the path forward for the most demanding semiconductor applications and enabling high-density Advanced Integration at the Leading Edge, today.