PRESENTATION

High Volume Sintering of Molded Power Packages on Water Coolers for BEV Applications

As BEV inverter designs reach new levels of power density and reliability, this talk explores how advanced sintering enables efficient and durable bonding of molded power modules to water coolers. It presents scalable, automated production solutions that deliver high yield and surpass soldering in thermal performance and long-term stability.

Thomas Krebs

PINK GmbH Thermosysteme

Since 2025 Technology Consultant at PINK GmbH Thermosysteme, Wertheim 2023 – 2024 Head of Coating Technology at COTEC GmbH, Karlstein 2019 – 2022 Head of Customer Application at PINK GmbH Thermosysteme, Wertheim 2016 – 2018 Global Head of Application at SLM Solutions AG, Lübeck 2004 – 2016 Several functions at Heraeus, Hanau, e.g. o Groupleader R&D and Application for sintering materials o Head of Application of materials for power electronics o Project Engineer for development of packing material o Application Engineer for China and Taiwan o Application Engineer for semiconductor packing material Mr. Krebs published several papers in the field of wafer bumping and sintering as well as articles in Bodos Power and Power Electronics Europe.