PRESENTATION

Innovations in Dynamic Switch Power Testing

Power WBG devices such as SiC and GaN introduced a step change in power conversion efficiency and size reduction due to their low loss and high switching speed. With the relatively recent introduction of these WBG devices compared with conventional Silicon power devices, manufacturers are pushing application-focussed switching tests as early as possible into their production test flow to expose devices to real-life situations. Early testing at die level can reduce the overall cost of test and improve the end product long-term reliability. We will explore the kinds of dynamic switch testing relevant to power devices, practical considerations at die test and the importance of a flexible and fast approach to tester design.

Robert Pulman

ipTEST

Robert Pulman is Product and Application manager at ipTEST, part of the Microtest group, where he has held multiple roles with 15 year's experience from design engineer to marketing manager. Prior to joining ipTEST he held technical marketing positions in technology startups including inkjet printing and RFID providers. He holds a Bachelor degree in Electronics from the University of Brighton.