Power, automotive, and IoT device manufacturers are constantly confronted with the simultaneous need to fulfill stringent quality requirements, boost productivity on their production lines, and reduce the associated cost of ownership (CoO). Inline inspection and measurement of high volumes of critical wafers is becoming increasingly crucial. SCREEN Semiconductor Solutions is addressing this specific market need with a portfolio of dedicated tools, specifically designed to reduce tool cost, footprint, downtime, and electricity consumption. On the thickness measurement front, the VM-3500 system offers spectroscopic reflectometry integrated with high-throughput features, while the RE-3500 system, combines single-wavelength spectroscopic ellipsometry, with triple reflectometry heads to accommodate different applications. On the optical inspection side, our toolset includes ZI-2000, working with a fixed resolution, ZI-3500, available with macro backside and backside edge inspection modules, and ZI-3600, which achieves automatic defects inspection and classification doubling the throughput compared to the previous generation. Additionally, our new software, powered by artificial intelligence (AI), drastically reduces the detection of false defects.
Alessandro Rossi is the product manager of metrology and lithography tools at SCREEN. In his 26 years within the company, he has first covered the service and customer support role in Europe before moving to the application support on lithography, thickness measurement (silicon and photovoltaic application), and automatic defect inspection tools. He was involved in many joint development project (JDP) in litho immersion process and negative tone developer, and he has gathered several years of experience on SiC applications.