This presentation introduces a novel Zero-Flux Residue technology for solder pastes used in formic acid reduction reflow ovens, addressing key challenges in power device soldering. Traditional methods, which rely on rosin-based flux solder pastes or solder preforms, often suffer from process inefficiencies, residue-related reliability concerns, and additional cleaning requirements. The newly developed flux technology maximizes formic acid’s reduction potential while incorporating heat-resistant agents that bond solder powders during preheating, ensuring superior meltability and wettability. Notably, all flux components fully evaporate at temperatures below typical lead-free solder reflow peak temperatures, leaving no residue. This innovation streamlines production, eliminates post-soldering cleaning processes, reduces overall manufacturing costs, and contributes to environmental sustainability.
Shantanu Joshi is the Head of Customer Solutions and Operational Excellence at KOKI Solder America and an Engineering Sales Manager at Koki Company Ltd., a global leader in soldering materials and solutions. With over 10 years of experience in electronics manufacturing, he has a strong background in research and development, process optimization, and reliability engineering. He is also pursuing a Ph.D. in Industrial and Systems Engineering with a focus on electronics manufacturing at Binghamton University. In his current role, Shantanu drives business growth in North America through consultative selling, fostering relationships with key decision-makers, and supporting territory manufacturer representatives. He collaborates with top engineers and scientists to address electronics packaging reliability challenges and contributes to soldering flux design. His research findings have been published in journals, conference papers, and a book chapter. Passionate about advancing electronics manufacturing, he is committed to delivering high-quality solutions to customers worldwide.