PRESENTATION

Advancing Photonic Packaging and Integration Through UV Nanoimprint Lithography

The rapid expansion of AI is driving unprecedented demand for high‑performance optical integration, exposing critical bottlenecks in bandwidth, latency, and energy efficiency. As photonic technologies advance in areas such as optical communications, laser systems, 3D sensing, and spectral imaging, scalable and cost‑effective integration becomes essential. However, traditional manufacturing approaches struggle to meet requirements for increasing integration density, precise alignment, and efficient fiber‑to‑chip coupling. Wafer‑level fabrication offers a path forward, enabling compact and reliable photonic components through precise control of nanostructure geometries, including lenses, gratings, mirrors, and waveguides. Within this landscape, UV Nanoimprint Lithography (UV‑NIL) has emerged as a key enabling technology, providing high‑resolution patterning, large‑area scalability, and accurate alignment for complex 3D structures. Its compatibility with diverse materials and suitability for both R&D and mass production make it particularly valuable for AI‑driven applications such as Silicon Photonics, Co‑Packaged Optics, microlens arrays, DFB laser gratings, and advanced coupling interfaces.