Tomoyuki Sonoda

Specialist

Panasonic Connect

Tomoyuki Sonoda has been deeply involved in the semiconductor industry since joining Panasonic. Since 2000, he has specialized in bonding equipment, contributing to the development and application design of die bonders and flip-chip bonders.

From 2012 onward, he played a key role in bonding process development and served as a development manager for four years. Since 2021, he has been leading product planning and marketing strategies for the bonder business.

Today, Tomoyuki is actively engaged in advancing ultrasonic bonding technology for semiconductor packaging, focusing on market expansion and innovative customer solutions.