Sonoda Tomoyuki
Specialist
Panasonic Connect
Tomoyuki Sonoda has been deeply involved in the semiconductor industry since joining Panasonic. Since 2000, he has specialized in bonding equipment, contributing to the development and application design of die bonders and flip-chip bonders.
From 2012 onward, he played a key role in bonding process development and served as a development manager for four years. Since 2021, he has been leading product planning and marketing strategies for the bonder business.
Today, Tomoyuki is actively engaged in advancing ultrasonic bonding technology for semiconductor packaging, focusing on market expansion and innovative customer solutions.
Presentations
Hot Die Pre-bonding Using Ultrasonic Technology for Power Module Manufacturing
The MD-P300 die attach bonder enables high-quality, high-productivity pre-bonding of SiC chips for power module production. In EV applications, SiC chips are pre-bonded to DBC substrates using Ag sintering materials, a process requiring high pressure, long bonding times, and high temperatures, leading to oxidation and lower productivity. To address these challenges, we integrated ultrasonic technology into the MD-P300 pre-bonding process. This approach successfully reduced temperature, pressure, and bonding time. In our presentation, we will detail the ultrasonic bonding mechanism and key parameters influencing the bonding characteristics of SiC/Ag sintering materials.