Dr Wang received the PhD degree in Microelectronics and Solid-State Electronics from Peking University, P. R. China, and joined the power semiconductor R&D Centre of Dynex in 2012. He had been leading the R&D Centre for responsible for developing power Si and WBG devices and packaging technologies, and releasing high performance and high reliability products. He is now responsible for the technical application support to customers, qualification and reliability, as well as the quality assurance of company’s products. He has co-authored more than 100 technical papers and 50 patents. He is the Senior Member of IEEE, Fellow of IET and Chartered Engineer of UK.