Vacuum Soldering with Integrated Volatile Capture and Soft Cooling Technologies

The continuous demand for higher reliability and performance in power electronics assembly necessitates innovative approaches to soldering processes. Traditional soldering methods often face challenges such as flux residue accumulation and the formation of voids during solidification, which can degrade the performance and lifespan of electronic components. This paper introduces a state-of-the-art vacuum soldering system equipped with groundbreaking features: a volatile capture cooling trap and a soft cooling chamber. These advancements are encapsulated in the modular and flexible design of Pink’s VADU vacuum soldering systems. Beside of the proven formic acid processing of the equipment, these systems feature intelligent temperature management and process capabilities that ensure void-free soldering, critical in high-reliability applications.