Huub Claassen
BDM for Boschman Advanced Packaging Technology and Co-founder / CCO for Powertrim Technologies
Boschman Advanced Packaging Technology / Powertrim Technologies
Graduate engineer in Mechanical Engineering and Electronics, 1986
Various positions in Back-end assembly Process Engineering at NXP Nijmegen and LSI Logic Freemont & Braunschweig.
Founding member of PS Systems, a Trim and Form equipment supplier, which was sold to Multitest, Germany.
From 1996 to 2005 Director of Sales for the Besi group and from 2005 to 2019 Managing Director of TOWA Europe B.V., both companies are active in back-end assembly equipment, with the focus on Transfer Molding and Die-bonding processes.
Since September 2019 Business Development Manager for Boschman Advanced Packaging Technology and Co-founder / Chief Commercial Officer (CCO) for Powertrim Technologies.
Presentations
Enabling Interconnect and Final Assembly Technologies for EV Power Module Manufacturing
For high-power applications, the industry is moving to next generation semiconductor materials, so called Wide-bandgap materials (WBG) to replace Silicon (Si) such as Silicon Carbide (SiC) and Gallium Nitride (GaN). While these materials offer breakthrough properties, they are not a drop-in replacement and essentially require all new designs, materials, and processes to deal with higher temperatures and offer better thermal resistance, performance and reliability. Specifically, for back-end semiconductor packaging: 1. Silver Sintering (to replace and overcome thermal limitations of tin solders) 2. Epoxy Molding (to replace and overcome thermal limitations of silicone gel) 3. Trimming and Forming of Power leads and signal pins Boschman has pioneered Sintering & Epoxy Molding processes with early adopters in the industry and has positioned itself as the market leader for both Pressure Sintering and Advanced Transfer Molding. POWERTRIM technologies has pioneered Trim & Form and final assembly processes such as laser marking, laser welding, testing and AOI with early adopters in the industry and has positioned itself as the market leader for Power module Trim & Form / final assembly automation.