Huub Claassen

BDM for Boschman Advanced Packaging Technology and Co-founder / CCO for Powertrim Technologies

Boschman Advanced Packaging Technology / Powertrim Technologies

Graduate engineer in Mechanical Engineering and Electronics, 1986

Various positions in Back-end assembly Process Engineering at NXP Nijmegen and LSI Logic Freemont & Braunschweig.

Founding member of PS Systems, a Trim and Form equipment supplier, which was sold to Multitest, Germany.

From 1996 to 2005 Director of Sales for the Besi group and from 2005 to 2019 Managing Director of TOWA Europe B.V., both companies are active in back-end assembly equipment, with the focus on Transfer Molding and Die-bonding processes.

Since September 2019 Business Development Manager for Boschman Advanced Packaging Technology and Co-founder / Chief Commercial Officer (CCO) for Powertrim Technologies.