# PE International 2026 Programme

Two days of technical talks, panels and networking across power electronics devices, packaging, applications and the wider chip-level supply chain. Sessions and timings below are subject to change.

## Sunday 19 April 2026 (starting at 11:00 CET)

- 11:00 - AngelTech Innovate Summit - Limited places! Requires separate registration: https://www.angeltech-innovate.net/register
- 18:00 - Pre-conference Networking Drinks / Dinner Reception (available to those who have registered for 21st & 22nd April for AngelTech Conference)

## Monday 20 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Conference Chair

**Theme: Putting the Automotive Industry in Pole Position**

- 09:00 - EV Inverter Drives above 100 kW Are Expected to Transition to GaN. Where Does the Roadmap End? - presented by Daniel Murphy (Cambridge GaN Devices)
- 09:20 - Accelerating the Development of Next-Generation Silicon Carbide (SiC) Traction Inverters for Electric Mobility Applications - presented by Pierre Delatte (Cissoid Power Semiconductors)
- 09:40 - Scalable Traction Inverter Designs for LEVs (Two-/Three-Wheelers, Micro E-Utility …) - presented by Philipp Mai (Arrow Electronics)
- 10:00 - Powering the Future: How Semiconductor Innovation is Driving the Software-defined Vehicle Era - presented by Téa Williams (GlobalFoundries)
- 10:20 - Morning Break and Networking
- 10:50 - Zonal Architectures and 48V Board Networks Are Transforming Automotive Design: What This Means for Power Semiconductors - presented by Christoph Stangl (Allegro MicroSystems)
- 11:10 - Next Generation of Power Electronic Systems: Driving Efficiency through System Optimization - presented by Dr. Fabian Hohmann (Replacement Speaker) (Onsemi)
- 11:30 - High Volume Sintering of Molded Power Packages on Water Coolers for BEV Applications - presented by Maximilian Rodemers (PINK GmbH Thermosysteme)
- 11:50 - Understanding the Transition from 12V to 48V Low Voltage Power Net - presented by Donovan Porter (Texas Instruments)
- 12:10 - Lunch Break and Networking

**Theme: Engineering Innovation with WBG Devices, Circuits and Materials**

- 13:40 - Redefining Data Center Power: GaN and SiC Technologies for Next-Gen 800 VDC Infrastructure - presented by Matteo Uccelli (Navitas)
- 14:00 - Precision Current Measurement Techniques Using Special Shunts and Voltage Probes - presented by Sahil Kacharekar (Tektronix)
- 14:20 - Innovations in Dynamic Switch Power Testing - presented by Robert Pulman (COSMIC)
- 14:40 - A Cost-effective Solution for WBG Testing Challenges - presented by Giacomo Tonti (Advantest)
- 15:00 - 800V Automotive DC Bus Domain: Evolving Requirements for Semiconductor Voltage Robustness - presented by Manuel Gärtner (STMicroelectronics)
- 15:20 - Afternoon Break and Networking
- 15:50 - The Value of GaN BDS in Next-Generation Power Electronics - presented by Marco Ruggeri (Renesas)
- 16:10 - Breaking the 1MHz Barrier: System-Level Benefits of Ultra High Frequency GaN Motor Drives - presented by James Cannings (QPT)
- 16:30 - (Ultra)widening the Gap: The applications carved by SiC and GaN, and how UWBG materials could disrupt this space. - presented by Matthew Fall (IDTechEx)
- 16:50 - Advancing SiC Substrate and Epitaxial Technologies for Next-Generation Power Devices - presented by Rajan Rengarajan (Coherent)
- 17:10 - Closing Remarks
- 18:00 - Networking Drinks and Dinner Reception (concludes around 20:00)
- 18:30 - AngelTech Rump Session - Bottlenecks & Battlegrounds: The Future of the AI Chip Ecosystem - presented by David Cheskis (Square Zero Technologies), Diana Khlan (Chips Weekly)

## Tuesday 21 April 2026 (starting at 08:00 CET)

- 08:00 - Registration and welcome refreshments
- 08:50 - Housekeeping by Conference Chair

**Theme: Delivering AI-driven Data Centre Densification**

- 09:00 - Intelligent Power Semiconductor Computing - presented by Danilo Pau (STMicroelectronics)
- 09:20 - Data Center Power Train: Emerging Solutions for Uncertain Market! - presented by Hassan Cheaito (Yole Group)
- 09:40 - High-Frequency GaN Power Conversion: Supercharging AI Data-Centre Density - presented by Matteo Uccelli (Navitas)
- 10:00 - Renesas System Solutions from Grid to Core in AI-Datacenter - presented by Marco Ruggeri (Renesas)
- 10:20 - Morning Break and Networking
- 11:00 - Power Semiconductor Solutions for 800V Datacentre Architectures - presented by Dr. Christian Felgemacher (ROHM Semiconductor Europe)
- 11:20 - Collaborating to Advance Integrated Voltage Regulation for AI and Cloud Infrastructure - presented by Noah Sturcken (Ferric)
- 11:40 - Vertical Power Delivery with Current Multiplication - presented by Maury Wood (Vicor)
- 12:00 - Lunch Break and Networking
- 13:30 - The Power to Compute: Enabling AI Data Centers from Grid Connection to Processor Core - presented by Aleksei Cherkasov (Infineon)
- 13:50 - Introducing imec.kelis: A Datacenter Performance Model for AI Densification - presented by Dr. Wenzhe Guo (inTEC GROUP)

**Theme: Ensuring a Renewable, Sustainable Future**

- 14:10 - Power Semiconductors for the Future Power Grid - presented by Tobias Keller (Hitachi Energy)
- 14:30 - Diamond Power Electronics: Beyond Ultra-high Voltage - presented by Ivan Llaurado (DIAMFAB)
- 14:50 - Closing Remarks

Sessions and timings are subject to change.

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